Low viscosity, undiluted Bis-F phenol novolac resin with high functionality, enhanced for added air release and fiberglass compatability. Increased flexibility and chemical resistance as compared to standard Bis-A resins. Higher functionality (2.15) than competitive resins of similar viscosity. Exceptionally low hydrolyzable chloride content makes this resin a good material for electronics applications such as potting and encapsulation. No solvents, 100% solids, low odor and toxicity, DOT non-regulated.
Filament winding, hand lay up laminating, vacuum bagging, tooling and pattern work, electronics, castings, surface coatings and chemically resistant flooring.